5DX
| Home |
| Surface Mount |
| Through Hole |
| Test |
| Capabilities |
| Process |
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In a single pass (one sweep of X-ray source over board). 3D Laminogrophy finds up to 90% of all defects on single and double sided boards. It tests reflowed and wave-soldered joints and measures the thickness and volume of solder paste. 3D Laminography has shown the greates accuracy in creating and analyzing multiple image "slices" on a given target.
The 5DX is used to test some of the most advanced packages, devices and components in use today.
5DX Is Capable of Detecting:
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